The US Department of War has quietly removed two of China’s most prominent memory manufacturers from its restricted list, a move that could reshape global semiconductor supply chains. ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC)—both major players in DRAM and NAND production—are no longer classified as threats under the Pentagon’s Section 1260H restrictions, effective with the latest update in January.

This shift eliminates a critical political barrier for US-based tech companies exploring Chinese memory chips, particularly as global shortages persist. For years, CXMT and YMTC were blacklisted, forcing OEMs to avoid their products entirely. Now, manufacturers may reconsider partnerships, though additional regulatory obstacles—like Commerce Department restrictions—still apply.

YMTC, a leader in NAND flash, and CXMT, which has signaled plans to ramp up HBM3 production for AI workloads, could gain broader access to US markets. Yet, the decision doesn’t guarantee immediate adoption; OEMs will weigh risks against the need for stable memory supplies.

Pentagon Delists Key Chinese Memory Firms, Clearing Path for DRAM and NAND in US Tech

Key specs and context

  • Removed companies: ChangXin Memory Technologies (CXMT), Yangtze Memory Technologies (YMTC).
  • Restriction type: Pentagon’s Section 1260H list (Communist Chinese Military Companies).
  • Effective date: January 7, 2026 (latest update).
  • Remaining barriers: US Commerce Department’s Entity List (YMTC still affected).
  • Potential impact: Faster integration of Chinese DRAM/NAND in PCs, servers, and AI hardware.

While the delisting opens doors, tech firms remain cautious. CXMT’s focus on HBM3—critical for AI accelerators—could make it a stronger candidate for adoption, but broader supply chain trust must be rebuilt. For now, the change signals flexibility in US policy, but OEMs will proceed methodically.